Funder
Swedish Governmental Agency for Innovation Systems (VINNOVA)
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference37 articles.
1. Lead-free solder joint trends;Clech,2005
2. Automotive PBGA assembly and board-level reliability with lead-free versus lead-tin interconnect;Mawer;J. SMT,2001
3. Pb-free solder joint reliability in a mildly accelerated test condition;Smetana,2011
4. Effects of board design variations on the reliability of lead-free solder joints;Ma;IEEE Trans. Compon. Packag. Manuf. Technol.,2013
Cited by
8 articles.
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