Setting stress conditions that qualify application expectations-Reference-Cited by-同舟云学术

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Setting stress conditions that qualify application expectations

Published:2015-12 Issue:12 Volume:55 Page:2484-2492
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Roesch William J.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference24 articles.

1. Developing Power Amplifier Module Standards for Reliability Qualification;Roesch,2014

2. Developing power amplifier module standards: 2013 Update;Roesch,2013

3. JC-14.3 Meeting #77,2013

4. Correlating quality and reliability: not your father's bathtub curve;Roesch,2012

5. Paradigm shift in ESD qualification;Duvvury,2008

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