Author:
Conrad M.,Diatlov A.,De Doncker R.W.
Funder
German Research Foundation DFG
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Thermal management details and their influence on the aging of power semiconductors;Schulz,2014
2. Fatigue of 60/40 solder;Solomon;Components, Hybrids, and Manufacturing Technology, IEEE Transactions on,1986
3. Thermo-mechanical simulation of plastic deformation during temperature cycling of bond wires for power electronic modules;Wright,2014
4. Planar power module with low thermal impedance and low thermomechanical stress;Cao;Components, Packaging and Manufacturing Technology, IEEE Transactions on,2012
5. High-performance heat sinking for VLSI;Tuckerman;Electron Device Letters, IEEE,1981
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