Failure mechanisms of microbolometer thermal imager sensors using chip-scale packaging-Reference-Cited by-同舟云学术

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Failure mechanisms of microbolometer thermal imager sensors using chip-scale packaging

Published:2015-08 Issue:9-10 Volume:55 Page:1901-1905
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Elßner Michael,Vogt Holger

Funder

Fraunhofer Institute for Microelectronic Circuits and Systems

University of Duisburg-Essen

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. Thermal Infrared Sensors: Theory, Optimisation and Practice;Budzier,2011

2. Uncooled infrared imaging arrays and systems;Kruse,1997

3. Infrared Detectors;Rogalski,2010

4. Recent development of ultra small pixel uncooled focal plane arrays at DRS;Li,2007

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Self-Calibration Method of Microbolometer With Vacuum Package;IEEE Sensors Journal;2020-08-01

2. High-resolution micro-grating accelerometer based on a gram-scale proof mass;Optics Express;2019-11-07

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