Improving cooling effectiveness by use of chamfers on the top of electronic components

Author:

Saleha Nemdili,Fadèla Nemdili,Abbès Azzi

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Cramming more components into integrated circuits;Moore;Electron Mag,1965

2. White Mark, Bernstein Joseph B. Microelectronics reliability: physics-of-failure based modeling and lifetime evaluation. Jet Propulsion Laboratory California Institute of Technology Pasadena, California, JPL Publication 08-5 2/08, .

3. Pecht Michael. The influence of temperature on microelectronic device failure, US Army SBIR PHASE II, final report, Ramsearch Company, Crofton; September 4, 1993.

4. Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs;Li;Microelectron Reliab,2011

5. Meinders ER. Experimental study of heat transfer in turbulent flows over wall-mounted cubes. Ph.D. Thesis. Delft University of Technology, The Netherlands; 1998.

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