Microstructural evaluation and failure analysis of Ag wire bonded to Al pads-Reference-Cited by-同舟云学术

Microstructural evaluation and failure analysis of Ag wire bonded to Al pads

Published:2015-11 Issue:11 Volume:55 Page:2306-2315
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Choi Mi-Ri,Kim Hyung-Giun,Lee Taeg-Woo,Jeon Young-Jun,Ahn Yong-Keun,Koo Kyo-Wang,Jang You-Cheol,Park So-Yeon,Yee Jae-Hak,Cho Nam-Kwon,Kang Il-Tae,Kim Sangshik,Han Seung-Zeon,Lim Sung-Hwan

Funder

Korean Ministry of Education, Science and Technology

Kangwon National University

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference46 articles.

1. Wire Bonding in Microelectronics—Materials, Processes, Reliability and Yield;Harman,1997

2. Electronic Packaging and Interconnection Handbook;Harper,2005

3. Advanced Wirebond Interconnection Technology;Prasad,2004

4. Copper Wire Bonding;Chauhan,2014

5. Comparison of Ag wire and Cu wire in memory package;Liqun;Electrochem. Soc. Trans.,2013

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