Author:
Chenniki Walide,Bord-Majek Isabelle,Louarn Mélanie,Gaud Vincent,Diot Jean-Luc,Wongtimnoi Komkrisd,Ousten Yves
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference26 articles.
1. Packaging with liquid crystal polymer;Pham;IEEE Microw. Mag.,2011
2. A new laminate material for high performance PCBs: liquid crystal polymer copper clad films;Culbertson;Electron. Compon. Technol. Conf.,1995
3. Dispersion of functionalized SiO2 particles into a liquid crystal polymer matrix for a reliable HF package;Chenniki,2013
4. Effect of surface functionalization of SiO2 particles on the interfacial and mechanical properties of PEN composite films;Pu;Colloids Surf. A,2012
5. Probabilistic design for reliability;Suhir;ChipScale Rev.,2010
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献