Author:
Chenniki Walide,Bord-Majek Isabelle,Louarn Mélanie,Gaud Vincent,Diot Jean-Luc,Wongtimnoi Komkrisd,Ousten Yves
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference26 articles.
1. Packaging with liquid crystal polymer;Pham;IEEE Microw. Mag.,2011
2. A new laminate material for high performance PCBs: liquid crystal polymer copper clad films;Culbertson;Electron. Compon. Technol. Conf.,1995
3. Dispersion of functionalized SiO2 particles into a liquid crystal polymer matrix for a reliable HF package;Chenniki,2013
4. Effect of surface functionalization of SiO2 particles on the interfacial and mechanical properties of PEN composite films;Pu;Colloids Surf. A,2012
5. Probabilistic design for reliability;Suhir;ChipScale Rev.,2010
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