Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs

Author:

Chen Cheng,Labrousse Denis,Lefebvre Stéphane,Petit Mickael,Buttay Cyril,Morel Hervé

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Switching and conducting performance of SiC-JFET and ESBT against MOSFET and IGBT;Knop,2008

2. High-temperature and high-frequency performance evaluation of 4H–SiC unipolar power devices;Chinthavali,2005

3. Experimental analysis of electro-thermal instability in SiC Power MOSFETs;Riccio;Microelectron. Reliab.,2013

4. Transient robustness testing of silicon carbide (SiC) power MOSFETs;Fayyaz,2013

5. Robustness of 1.2kV SiC MOSFET devices;Othman;Microelectron. Reliab.,2013

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1. Electro-thermal-mechanical multiphysics coupling analysis for the short-circuit failure of Si/SiC cascode device;2023 IEEE 6th International Electrical and Energy Conference (CIEEC);2023-05-12

2. Short-circuit and Avalanche Robustness of SiC Power MOSFETs for Aerospace Power Converters;2023 IEEE Aerospace Conference;2023-03-04

3. Short-Circuit Ruggedness and Partial Discharge Evaluation of a 3.3 kV SiC MOSFET Power Module;2022 IEEE 9th Workshop on Wide Bandgap Power Devices & Applications (WiPDA);2022-11-07

4. Short circuit ruggedness of SiC MOSFETs for high reliability applications;2022 IEEE Energy Conversion Congress and Exposition (ECCE);2022-10-09

5. Gate-damage safe failure-mode deep analysis under short-circuit operation of 1.2kV and 1.7kV power SiC MOSFET using dedicated gate-source / drain-source voltage depolarization and damage-mode optical imaging;2022 IEEE Workshop on Wide Bandgap Power Devices and Applications in Europe (WiPDA Europe);2022-09-18

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