Author:
Tsukuda M.,Tomonaga H.,Okoda S.,Noda R.,Tashiro K.,Omura I.
Funder
Ministry of Economy, Trade and Industry
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. Chip current measurement in IGBT modules;Domon;IEEJ,2004
2. Research of current distribution in IGBT modules with multiple chips in parallel;Babler,2005
3. The current sharing optimization of paralleled IGBTs in a power module tile using a PSpice frequency dependent impedance model;Azar,2008
4. Optimization of the current distribution in press-pack high power IGBT modules;Musing,2010
5. Tiny-scale “stealth” current sensor to probe power semiconductor device failure;Kasho;Microelectron. Reliab.,2011