Functional cyclic bending test for integrated inductors on flexible Kapton substrate
-
Published:2022-08
Issue:
Volume:135
Page:114592
-
ISSN:0026-2714
-
Container-title:Microelectronics Reliability
-
language:en
-
Short-container-title:Microelectronics Reliability
Author:
Freitas Wilson J.,Manera Leandro T.,Swart Jacobus W.
Funder
Coordenação de Aperfeiçoamento de Pessoal de Nível Superior
Conselho Nacional de Desenvolvimento Científico e Tecnológico
Centro Nacional de Pesquisa em Energia e Materiais
Laboratório Nacional de Nanotecnologia
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference39 articles.
1. Cramming more components onto integrated circuits;Moore;Electronics,1965
2. Moore´s law: repeal or renewal?;Bauer;McKinsey on Semiconductors,2013
3. – “System in Package: the Complement to Moore’s Law”n.d. see: https://octavosystems.com/2016/03/04/system-in-package-complement-moores-law/ (accessed 12 February 2022).
4. – P. Bright n.d. “Moore´s Law Really is Dead this Time”, see: https://arstechnica.com/information-technology/2016/02/moores-law-really-is-dead-this-time/ (accessed 12 February 2022).