Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor-Reference-Cited by-同舟云学术

Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor

Published:2022-10 Issue: Volume:137 Page:114742
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Riegel Daniel,Gromala Przemyslaw Jakub,Rzepka Sven

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference23 articles.

1. Computer Science Handbook;Tucker,2004

2. A study of the effects of cyclic thermal stresses on a ductile metal;Coffin;Trans. Am. Soc. Mech. Eng.,1954

3. Behaviour of materials under conditions of thermal stress;Manson,1954

4. BGA and CGA solder attachments: results of low-acceleration reliability test and analysis;Engelmaier;Soldering Surf. Mount Technol.,1996

5. Achieving solder joint reliability in a lead-free world, part 2;Engelmaier;Glob. SMT Packag.,2007

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