Author:
Chen Zhiwen,Li Yu,Xu Guoliang,Sun Chao,Liu Sheng,Ruan Meng,Liu Li
Funder
National Key Research and Development Program of China
Fundamental Research Funds for the Central Universities
Basic and Applied Basic Research Foundation of Guangdong Province
Natural Science Foundation of Hubei Province
National Natural Science Foundation of China
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference28 articles.
1. Development of mold-first fan-out panel-level packaging (FO-PLP) on 600mm x 600mm size panel;Rao,2020
2. 600MM wafer-level fan out on panel level processing with 6-sided die protection;Lim,2020
3. Shadow and projection Moire techniques for absolute or relative mapping of surface shapes;Pirodda;Opt. Eng.,1982
4. Automated phase-measuring profilometry of 3-D diffuse objects;Srinivasan;Appl. Opt.,1984
5. A study on the 3-D measurement by using digital projection moiré method;Ryu;Optik,2008