Author:
Huesgen T.,Sharma A.B.,Rawal K.B.,Polezhaev V.,Stohrer G.,Koch F.,Vaas M.
Funder
Bundesministerium für Wirtschaft und Energie
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. Power modules with embedded components;Ostmann;European Microelectronics Packaging Conference EMPC,2013
2. Packaging very fast switching semiconductors;Hoene;8th International Conference on Integrated Power Electronics Systems CIPS,2014
3. Minimizing form factor and parasitic inductances of power electronic modules: the p2 pack technology;Gottwald;7th Electronic System-Integration Technology Conference ESTC,2018
4. PCB embedded semiconductors for low-voltage power electronic applications;Kearney;IEEE Trans. Compon., Packag. Manufact. Technol.,2017
5. Lifetime and manufacturability of integrated power electronics;Randoll;Microelectron. Reliab.,2016
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