Author:
Fu Han-Kuei,Lin Chin-Wei,Chen Tzung-Te,Chen Chiu-Ling,Chou Pei-Ting,Sun Chien-Jen
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Cited by
15 articles.
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1. Optimize Screen CCTs in 3000K and 5000K Ambient CCTs;2022 19th China International Forum on Solid State Lighting & 2022 8th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS);2023-02-07
2. Using Ultraprecision Machining to Fabricate LED Packaging Exhibiting High Luminous Intensity;International Journal of Automation Technology;2019-05-05
3. Characteristics Study of Die-Bond Process of High-Power LED Package;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-11
4. A Gamma Process-Based Prognostics Method for CCT Shift of High-Power White LEDs;IEEE Transactions on Electron Devices;2018-07
5. A Review of Prognostic Techniques for High-Power White LEDs;IEEE Transactions on Power Electronics;2017-08