Author:
Jacques S.,Caldeira A.,Batut N.,Schellmanns A.,Leroy R.,Gonthier L.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference12 articles.
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2. Jacques S, Batut N, Leroy R, Gonthier L. Aging test results for high temperature Triacs during power cycling. In: Proceedings of IEEE Power Electronics Specialists Conference; 2008. p. 2447–52.
3. Reliability of lead-free solder interconnections in thermal and power cycling tests;Li;IEEE Trans Compon Packag Technol,2009
4. Jacques S, Diack PM, Batut N, Leroy R, GonthierL. Rise time and dwell time impact on Triac solder joints lifetime during power cycling. In: Proceedings of IEEE Microelectronics conference; 2010. p. 435–8.
5. TRIAC solder joints characterization: thermo-mechanical properties evaluation to build a lifetime prediction model;Jacques;Eur J Electr Eng,2011
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