Electro-thermal analysis and optimization of edge termination of power diode supported by 2D numerical modeling and simulation-Reference-Cited by-同舟云学术

Electro-thermal analysis and optimization of edge termination of power diode supported by 2D numerical modeling and simulation

Published:2012-03 Issue:3 Volume:52 Page:463-468
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Pribytny P.,Donoval D.,Chvala A.,Marek J.,Molnar M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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5. Hunger T, Schiling O. Numerical and experimental study on surge current limitations of wire-bonded power diodes, Nuremberg PCIM, 2007.

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