Research on size dependent integral melting thermodynamic properties of Cu nanoparticles-Reference-Cited by-同舟云学术

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Research on size dependent integral melting thermodynamic properties of Cu nanoparticles

Published:2020-10 Issue: Volume:149 Page:106148
ISSN:0021-9614
Container-title:The Journal of Chemical Thermodynamics
language:en
Short-container-title:The Journal of Chemical Thermodynamics

Author:

Cui Zixiang,Ji Boteng,Fu Qingshan,Duan Huijuan,Xue Yongqiang,Li Zongru

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Physical and Theoretical Chemistry,General Materials Science,Atomic and Molecular Physics, and Optics

Reference42 articles.

1. Synthesis of ultrathin copper nanowires using tris silane for high-per-formance and low-haze transparent conductors;Cui;Nano Lett.,2015

2. A rapid synthesis of high aspect ratio copper nanowires for high-performance transparent conducting films;Ye;J. Chem. Commun. Chem. Commun.,2013

3. Ultra sensitive and selective nonenzymatic glucose detection using copper nanowires;Zhang;Biosens. Bioelectron.,2012

4. Synthesis of copper submicro/nanoplates with high stability and their recyclable superior catalytic activity towards 4-nitrophenol reduction;Sun;Mater. Chem.,2013

5. Protein-directed synthesis of pH responsive red fluorescent copper nanoclusters and their applications in cellular imaging and catalysis;Wang;Nanoscale,2013

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Atomic fast dynamic motion on the Cu nanoparticle’s surface before melting: A molecular dynamics study;Applied Surface Science;2022-12

2. A unified bond energy model for size-dependent melting temperature of freestanding and embedded nanomaterials;Solid State Communications;2022-11

3. Probing binding processes of HSA adsorbed on rGO-AgNCs surfaces using multispectroscopic techniques;The Journal of Chemical Thermodynamics;2022-10

4. Nano-engineered pathways for advanced thermal energy storage systems;Cell Reports Physical Science;2022-08

5. Preparation and performance of an investigated temperature response device based on Sn–3.5 Ag film;Journal of Materials Science: Materials in Electronics;2022-07-13

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