Effects of milling time and sintering temperature on structural evolution, densification behavior and properties of a W-20wt.%Cu alloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference21 articles.
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3. From solid solutions to fully phase separated interpenetrating networks in sputter deposited “immiscible” W–Cu thin films;Vüllers;Acta Mater.,2015
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