1. The application of HITCE ceramic material for LGA-type chip scale package;Maeda;50th Electronic Components and Technology Conference (Cat. No. 00CH37070) IEEE,2000
2. HITCE ceramic material development for high speed memory devices;Kabumoto;SPIE Proc. Ser.,1999
3. Characterization of board level reliability of a system with flip chip HITCE BGA package through modeling and testing;Ron;58th Electron. Compon. Technol. Conf. IEEE,2008
4. Thermal analysis of a flip chip ceramic ball grid array (CBGA) package;Kandasamy;Microelectron. Reliab.,2008
5. Kandasamy R. (2006) PCM-based hybrid thermal management of electronic components.