Interface formation evolution of the hot-forged copper-(Cr)diamond composite and its thermal conductivity-Reference-Cited by-同舟云学术

Interface formation evolution of the hot-forged copper-(Cr)diamond composite and its thermal conductivity

Published:2023-05 Issue: Volume:943 Page:169133
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Jia S.Q.,Bolzoni L.,Li T.,Yang F.

Funder

Marsden Fund

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference27 articles.

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5. A systematic design to develop high-performance sintered particulate copper-composite as heat spreader material;Sohail Akhtar;Eng. Sci. Technol., Int. J.,2022

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