Author:
Yang Zhengyi,Qing Zhu,Li Enzhu,Tang Bin,Yuan Ying
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference46 articles.
1. Relationships of the degree of CC double bond conversion with the dielectric properties for SiO2/1,2–PB/SBS/EPDM composites cured by organic peroxide;Wu;ChemistrySelect,2022
2. Benzocyclobutene-functionalized poly(m-phenylene): a novel polymer with low dielectric constant and high thermostability;Tong;Polymer,2014
3. Influence of 1,2-polybutadiene as coagent in peroxide cured polypropylene/ethylene octene copolymer thermoplastic vulcanizates;Rajesh Babu;Mater. Des.,2010
4. C. Jesscia, A. Chandler, Circuit materials, circuits laminates, and method of manufacture thereof, Patent US 9258892B2, (2016).
5. Different organic peroxides that cure low‐k 1,2–PB/SBS/EPDM composites for high‐frequency substrate;Wu;J. Vinyl Addit. Technol.,2020
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