Effects of trace nano-TiB2 particles and multiple cooling rates on microstructure and properties of Al-4.5Cu alloy
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Reference42 articles.
1. The growth behavior and kinetics of intermetallic compounds in Cu–Al interface at 600°C–800 °C;Zhao;Intermetallics,2024
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3. Enhancement of mechanical properties of Al-Cu alloy composite reinforced by Ni element: A combination of mixture design of experiment and artificial neural network approach;Nikzad;Mater. Today Commun.,2024
4. Stress-induced symmetrical tilt boundaries in layer-structured Al-Cu eutectic alloys;Egusa;Scr. Mater.,2024
5. The nucleation sequence of α-Al on TiB2 particles in Al-Cu alloys;Li;Acta Mater.,2021
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