Solder electromigration in Cu/In/Cu flip chip joint system
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference37 articles.
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3. Microstructural evolution and change in macroscopic physical properties of microscale flip chip Cu/Sn58Bi/Cu joints under the coupling effect of electric current stressing and elastic stress;Journal of Materials Research;2019-07-16
4. The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing;Journal of Electronic Materials;2019-01-31
5. Effect of Sn crystallographic orientation on solder electromigration and Ni diffusion in Cu/Ni plating/Sn–0.7Cu joint at low current density;Journal of Materials Science: Materials in Electronics;2017-05-19
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