Fabrication and properties of Ni-modified graphene nanosheets reinforced Sn-Ag-Cu composite solder

Author:

Wang Huigai,Zhang Keke,Zhang Meng

Funder

National Natural Science Foundation of China

Plan for Scientific Innovation Talent of Henan Province, China

Major Scientific Research Foundation of Higher Education of Henan Province, China

National Science and Technology International Cooperation of China

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference62 articles.

1. The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling;Zhong;Mater. Sci. Eng. A,2016

2. Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders;Mohan Kumar;J. Alloys Compd.,2008

3. The morphology and evolution of Cu6Sn5 at the interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu solder joint during the isothermal aging;Wang;Mater. Sci. Forum,2012

4. Effect on interface and property of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints in severe thermal cycling;Guo;Chin. J. Nonferrous Metals,2016

5. The combined effects of ultrasonic wave and electric field on the microstructure and properties of Sn2.5Ag0.7Cu0.1RE/Cu soldered joints;Zhang;J. Mater. Sci. Mater. Electron.,2014

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