Author:
Islam M.N.,Chan Y.C.,Sharif A.,Rizvi M.J.
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference23 articles.
1. Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering
2. Y.C. Sohn, Jin Yu, S.K. Kang, D.Y. Shih, T.Y. Lee, ECTC (2004) 75–81.
3. Thermodynamic optimization of the lead-free solder system Bi–In–Sn–Zn
4. Lead‐free alloys
5. NCMS Reports 0401RE96. National Center for Manufacturing Sciences, Ann Arbor, MI, August, 1997.
Cited by
27 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献