Deformation banding and static recrystallization in high-strain-rate-torsioned Al-Mg alloy
Author:
Funder
Technology Innovation Program
Ministry of Trade, Industry & Energy
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference26 articles.
1. Recrystallization and Related Annealing Phenomena;Humphreys,1996
2. Deformation banding and copper-type rolling textures;Lee;Acta Metall. Mater.,1993
3. Discontinuous precipitation at the deformation band in copper alloy;Han;Met. Mater. Int.,2018
4. Deformation bands and the formation of grain boundaries in a superplastic aluminum alloy;McNelley;Metall. Mater. Trans. A,2002
5. The mechanisms of recrystallization in cubic metals with particular reference to their orientation-dependence;Dillamore;Met. Sci.,1974
Cited by 30 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Influence of forging pretreatments on microstructure evolution and surface roughness of Al 6061 alloy;Materials Today Sustainability;2024-12
2. Effect of homogenization annealing on microstructure evolution and homogeneity of twin-roll casting Al-Mg-Si plate;Journal of Alloys and Compounds;2024-11
3. Two-stage dynamic recrystallization and texture evolution in Al-7Mg alloy during hot torsion;International Journal of Minerals, Metallurgy and Materials;2024-08
4. Formation and strengthening mechanism of kink bands in an ultra-coarse-grained Fe-Cr-Al alloy;Journal of Materials Science & Technology;2024-07
5. Investigation on Recrystallization Behavior of Cold‐Rolled Silicon Steel in Continuous Heating with Three‐Point Bending Testing;steel research international;2024-01-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3