Phase equilibria and solidification of ternary Sn–Bi–Ag alloys
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference33 articles.
1. Lead-free Solders in Microelectronics
2. Interfacial embrittlement by bismuth segregation in copper/tin–bismuth Pb-free solder interconnect
3. Interfacial Reactions in the Sn-Bi/Te Couples
4. Phase Diagrams of Pb-Free Solders and their Related Materials Systems
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