Improved mechanical and thermophysical properties of additively manufactured Cu-Ni-Sn-P alloy by using aging treatment
Author:
Funder
Korea Institute for Advancement of Technology
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference36 articles.
1. Microstructural feature and aging characteristics of spray-formed Cu-5Ni-10Sn alloy;Roh;J. Korean Powder Metall. Inst.,2012
2. Ultrahigh strength and high electrical conductivity in copper;Lu;Science,2004
3. Microstructure and mechanical properties of a high strength Cu-Ni-Si alloy treated by combined aging processes;Lei;J. Alloy. Compd.,2017
4. Erosion-corrosion of copper-nickel alloys in sea water and other aqueous environments - a literature review;Syrett;Corrosion,1976
5. High-strength age hardening copper-titanium alloys: redivivus;Soffa;Prog. Mater. Sci.,2004
Cited by 14 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Influence of Ni content on electrochemical corrosion and tribological behavior of Cu-10Sn coatings by laser cladding;Materials Today Communications;2024-12
2. Enhanced mechanical properties and anti-wear performance of Cu45Mn8Ni40Sn7 medium entropy bronze alloy by multi-stage heat treatment;Journal of Alloys and Compounds;2024-11
3. Heat treating additive-manufactured alloys: A comprehensive review;Journal of Alloys and Compounds;2024-11
4. Microstructure and Texture Evolution of Cu-Ni-P Alloy after Cold Rolling and Annealing;Materials;2024-06-03
5. Distinct Electrical and Mechanical Responses of a Cu-10Fe Composite Prepared by Hot-Pressed Sintering and Post Treatment;Acta Metallurgica Sinica (English Letters);2024-01-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3