Microstructural evolution in directionally solidified Al-Cu-Mg ternary eutectic
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference39 articles.
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1. Thermal behaviour and microstructure evolution of new ternary eutectic alloy in Al-Cu-Si-Ni system;Journal of Alloys and Compounds;2023-04
2. Achieving Enhanced Strength Retention in Ultrafine-Fibrous Interconnected Al-Based Ternary Eutectic Alloy at Elevated Temperatures;2023
3. Microstructure evolution during directional solidification of off-eutectic Al-Cu-Mg alloys;IOP Conference Series: Materials Science and Engineering;2023-01-01
4. First-principles calculations to investigate mechanical, thermodynamic and electronic properties of Al2CuMg intermetallic compound under pressure effect;Computational Condensed Matter;2022-12
5. Identification of the Eutectic Points in the Multicomponent Systems with the High-Throughput CALPHAD Approach;Journal of Phase Equilibria and Diffusion;2022-10-25
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