Effect of boron content in electroless Ni–B layer on plating layer properties and soldering characteristics with Sn–Ag solder-Reference-Cited by-同舟云学术

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Effect of boron content in electroless Ni–B layer on plating layer properties and soldering characteristics with Sn–Ag solder

Published:2008-10 Issue:1-2 Volume:466 Page:73-79
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Yoon Jeong-Won,Koo Ja-Myeong,Kim Jong-Woong,Ha Sang-Su,Noh Bo-In,Lee Chang-Yong,Park Jong-Hyun,Shur Chang-Chae,Jung Seung-Boo

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference32 articles.

1. Nickel plating on steel by chemical reduction

2. An overall aspect of electroless Ni-P depositions—A review article

3. Structure and phase transformation behaviour of electroless Ni–P composite coatings

4. Effect of accelerators and stabilizers on the formation and characteristics of electroless Ni–P deposits

5. Temperature and pH dependence of the electroless Ni–P deposition on silicon

Cited by 23 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of the Zeta Potential on the Corrosion Resistance of Electroless Nickel and PVDF Composite Layers Using Surfactants;ACS Omega;2021-11-24

2. Effects of amorphous Co W and Ni W barrier layers on the evolution of Sn/Cu interface;Materials Characterization;2021-11

3. Influence of ceramic substrate quality on CBGA assembly reliability;Engineering Failure Analysis;2021-05

4. Inorganic salts stabilizers effect in electroless nickel-boron plating: Stabilization mechanism and microstructure modification;Surface and Coatings Technology;2020-11

5. Effect of pH on Dimethylamine Borane Reduced Electroless Nickel Deposits on AISI/SAE 1045 Steel Surface;Metals and Materials International;2019-07-17

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