Author:
Jhong Yu-Siang,Tseng Hsiao-Ting,Lin Su-Jien
Funder
Ministry of Science and Technology, Taiwan
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference41 articles.
1. Cooling a microprocessor chip;Mahajan;Proc. IEEE,2006
2. International Technology Roadmap for Semiconductors 2.0 2015 Edition – Executive Report;ITRS,2015
3. Advanced materials for optoelectronic packaging;Zweben;Electron. Packag. Prod.,2002
4. Thermal properties of diamond/Ag composites fabricated by electroless silver plating;Lee;Diam. Relat. Mater.,2011
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