Wettability of Ag nanocluster on Cu-Ni alloys: A computational approach-Reference-Cited by-同舟云学术

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Wettability of Ag nanocluster on Cu-Ni alloys: A computational approach

Published:2016-10 Issue: Volume:682 Page:844-849
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Chung Dong Hyen,Guk Hyein,Choi Seung-Hoon,Kim Daejin

Funder

Industrial Strategic Technology Development Program

Ministry of Trade, Industry & Energy, Republic of Korea

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference25 articles.

1. Silver thick-film contacts on highly doped n-type silicon emitters: structural and electronic properties of the interface;Ballif;Appl. Phys. Lett.,2003

2. Inkjet printing of narrow conductive tracks on untreated polymeric substrates;van Osch;Adv. Mater.,2008

3. Physical understanding of the behavior of silver thick-film contacts on n-type silicon under annealing conditions;Kontermann;Sol. Energy Mater. Sol. Cells,2009

4. Screen-printed masking of transparent conductive oxide layers for copper plating of silicon heterojunction cells;Khanna;Appl. Surf. Sci.,2015

5. Oxidation behavior of Cu–Ag core-shell particles for solar cell applications;Hai;J. Alloys Compd.,2013

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