The interdiffusion in copper-nickel alloys
Author:
Funder
National Science Centre
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference24 articles.
1. Percolation effects during interdiffusion in the Cu-NiAl system
2. Transient liquid-phase bonding in the NiAl/Cu/Ni system-A microstructural investigation
3. Development of intermetallic materials for aerospace systems
4. Binary Alloy Phase Diagrams,1986
5. Ni tracer diffusion in the B2-compound NiAl: influence of temperature and composition
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