Densification mechanism of copper micro-components prepared by the micro-forming fields activated sintering technology-Reference-Cited by-同舟云学术

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Densification mechanism of copper micro-components prepared by the micro-forming fields activated sintering technology

Published:2017-01 Issue: Volume:692 Page:434-439
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Wu Mingxia,Yang Gang,Liu Jian,Yin Deqiang,Yang Yi

Funder

Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference28 articles.

1. A review on micro-manufacturing, micro-forming and their key issues;Razali;Procedia Eng.,2013

2. A review on the state-of-the-art microforming technologies;Fu;Int. J. Adv. Manuf. Technol.,2013

3. Micro-manufacturing: research, technology outcomes and development issues;Qin;Int. J. Adv. Manuf. Technol.,2010

4. Micro-EDM: recent developments and research issues;Pham;J. Mater. Process. Technol.,2004

5. Analysis of laser-heating methods for micro-parts stamping applications;Peng;J. Mater. Process. Technol.,2004

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