Earth abundant thin film solar cells from co-evaporated Cu2SnS3 absorber layers-Reference-Cited by-同舟云学术

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Earth abundant thin film solar cells from co-evaporated Cu2SnS3 absorber layers

Published:2016-12 Issue: Volume:689 Page:182-186
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Marquez Prieto Jose A.,Levcenko Sergiu,Just Justus,Hampel Hannes,Forbes Ian,Pearsall Nicola M.,Unold Thomas

Funder

Seventh Framework Programme of the European Commission

Helmholtz Association Initiative and Network Fund

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference27 articles.

1. Cu2SnS3 thin-film solar cells fabricated by sulfurization from NaF/Cu/Sn stacked precursor;Nakashima;Appl. Phys. Express,2015

2. Phase relations and optical properties of semiconducting ternary sulfides in the system Cu–Sn–S;Fiechter;J. Phys. Chem. Solids,2003

3. A study of ternary Cu2SnS3 and Cu3SnS4 thin films prepared by sulfurizing stacked metal precursors;Fernandes;J. Phys. D Appl. Phys.,2010

4. Raman analysis of monoclinic Cu2SnS3 thin films;Berg;Appl. Phys. Lett.,2012

5. Thin film solar cells based on the ternary compound Cu2SnS3;Berg;Thin Solid Films,2012

Cited by 24 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Recent developments and prospects of copper tin sulphide (Cu2SnS3) thin films for photovoltaic applications;Chemical Engineering Science;2024-04

2. Preparation and growth mechanism of centimeter-scale (Ag_xCu_1−x)₂ZnSnS₄ single crystals via a molten salt method;CrystEngComm;2024

3. Investigation on photovoltaic performance of Cu2SnS3 thin film solar cells fabricated by RF-sputtered In2S3 buffer layer;Journal of Alloys and Compounds;2023-07

4. High Performance Quaternary Chalcogenides for Solar Energy Conversion;Reference Module in Earth Systems and Environmental Sciences;2023

5. Polymorphic Control of Solution-Processed Cu₂SnS₃ Films with Thiol–Amine Ink Formulation;Chemistry of Materials;2022-09-21

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