Regulation of primary phase in Cu-Cr-Zr alloy and its effect on nano-structure and properties
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference52 articles.
1. Composition design, phase transition and fabrication of copper alloys with high strength and electrical conductivity;Li;Chin. J. Nonferrous Met.,2019
2. Review of nano-phase effects in high strength and conductivity copper alloys;Zhang;Nanotechnol. Rev.,2019
3. High strength and high conductivity Cu alloys: a review;Yang;Sci. Chin. Tech. Sci.,2020
4. Low cycle fatigue behavior of precipitation-strengthened Cu-Cr-Zr contact wires;Wang;Int. J. Fatigue,2020
5. Grain refinement kinetics and strengthening mechanisms in Cu-0.3Cr-0.5Zr alloy subjected to intense plastic deformation;Zhilyaev;Mat. Sci. Eng. A-Struct.,2016
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Enhanced strength of a high-conductivity Cu-Cr alloy by Sc addition;Rare Metals;2024-09-04
2. The phase structure, hardness, and wear properties of the Cu-Cr-Zr-Nb alloy under different aging states;Journal of Materials Research and Technology;2024-09
3. The influence of traction speed on the microstructure and properties of vacuum horizontal continuous casting Cu–5Fe–0.15Sn alloy;Materials Science and Technology;2024-06-11
4. Synergistic improvement of strength and electrical conductivity in Cu–Cr–Zr alloys through prestrain-assisted friction stir processing;Journal of Materials Research and Technology;2023-11
5. Recent development of advanced precipitation-strengthened Cu alloys with high strength and conductivity: A review;Progress in Materials Science;2023-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3