Phase stability of Ti-containing high-entropy alloys with a bcc or hcp structure
Author:
Funder
Mitsubishi Foundation
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference39 articles.
1. Microstructural development in equiatomic multicomponent alloys;Cantor;Mater. Sci. Eng. A 375–,2004
2. Nanostructured high-entropy alloys with multiple principal elements: novel alloy design concepts and outcomes;Yeh;Adv. Eng. Mater.,2004
3. High-entropy alloy: challenges and prospects;Ye;Mater. Today,2016
4. Alloy designs for high-entropy alloys, bulk metallic glasses and high-entropy bulk metallic glasses;Takeuchi;J. Jpn. Inst. Met. Mater.,2015
5. High-entropy alloys with a hexagonal close-packed structure designed by equi-atomic alloy strategy and binary phase diagrams;Takeuchi;JOM,2014
Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The effect of constituent phases on microstructure and high temperature deformation mechanisms of IrRhRuWMo complex concentrated alloys;Materials Science and Engineering: A;2024-10
2. Structural Particularities, Prediction, and Synthesis Methods in High-Entropy Alloys;Applied Sciences;2024-08-27
3. Effect of Annealing and Double Aging on the Microstructure and Mechanical Properties of Hot-Rolled Al17Cr10Fe36Ni36Mo1 Alloy;Metals;2024-06-19
4. Effect of Zr content on microstructure and mechanical properties of MoNbTaTiZrx refractory high-entropy alloy;Journal of Physics: Conference Series;2024-06-01
5. High Temperature B2 Precipitation in Ru-Containing Refractory Multi-principal Element Alloys;Metallurgical and Materials Transactions A;2024-04-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3