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Real time joint resistance monitoring during solder reflow

  • Published:2017-02 Issue: Volume:695 Page:3002-3010
  • ISSN:0925-8388
  • Container-title:Journal of Alloys and Compounds
  • language:en
  • Short-container-title:Journal of Alloys and Compounds

Author:

Xu Di ErickORCID,Hook Michael David,Mayer Michael

Funder

Natural Science and Engineering Research Council (NSERC) of Canada

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference27 articles.

1. Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies;Lee,2002

2. Manufacturing Challenges in Electronic Packaging;Lee,1998

3. Displacement of components and solder during reflow soldering;Klein Wassink;Solder. Surf. Mt. Technol.,1989

4. Parameters affecting the incidence of pad bridging in surface mounted device attachment;Roos-Kozel;Microelectron. Int.,1985

5. Minimizing solder spatter impact;Berntson;SMT Surf. Mt. Technol. Mag.,2000

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Industrial Soldering Process Simulator;Applied Sciences;2023-11-21

2. Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi9 Microwire and Au Microlayer;Micromachines;2021-01-03

3. SAC305 Solder Reflow: Identification of Melting and Solidification Using In-Process Resistance Monitoring;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-08

4. Dynamic resistance monitoring of aging process of pressureless sintered nano-silver joints;2019 20th International Conference on Electronic Packaging Technology(ICEPT);2019-08

5. Real time resistance monitoring during sintering of silver paste;Journal of Alloys and Compounds;2018-01
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