Contact resistance and stability study for Au, Ti, Hf and Ni contacts on thin-film Mg 2 Si-Reference-Cited by-同舟云学术

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Contact resistance and stability study for Au, Ti, Hf and Ni contacts on thin-film Mg 2 Si

Published:2017-03 Issue: Volume:699 Page:1134-1139
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Zhang Bo,Zheng Tao,Wang Qingxiao,Zhu Yihan,Alshareef Husam N.,Kim Moon J.,Gnade Bruce E.

Funder

II-VI foundation

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference33 articles.

1. Potential applications of advanced thermoelectrics in the automobile industry, Fifteenth Int;Morelli;Conf. Thermoelectr. Proc. ICT,1996

2. Low resistance Ohmic contacts to Bi2Te3 using Ni and Co metallization;Gupta;J. Electrochem. Soc.,2010

3. High figures of merit and natural nanostructures in Mg2Si0.4Sn0.6 based thermoelectric materials;Zhang;Appl. Phys. Lett.,2008

4. High thermoelectric figure of merit of Mg2Si0.55Sn0.4Ge0.05 materials doped with Bi and Sb;Khan;Scr. Mater.,2013

5. High figure of merit and thermoelectric properties of Bi-doped Mg2Si0.4Sn0.6 solid solutions;Liu;J. Solid State Chem.,2013

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