Understanding non-parabolic solidification kinetics in Ni-based alloys during TLP bonding via thermo-kinetic modelling-Reference-Cited by-同舟云学术

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Understanding non-parabolic solidification kinetics in Ni-based alloys during TLP bonding via thermo-kinetic modelling

Published:2017-03 Issue: Volume:699 Page:1084-1094
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Bai Kewu^ORCID,Ng Fern Lan,Tan Teck L.,Li Tao,Pan Dayou

Funder

A*STAR Singapore

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference25 articles.

1. Overview of transient liquid phase and partial transient liquid phase bonding;Cook;J. Mater. Sci.,2011

2. Modelling of transient liquid phase bonding in binary systems—a new parametric study;Illingworth;Mater. Sci. Eng. A,2007

3. Transient liquid phase bonding;MacDonald;Annu. Rev. Mater. Sci.,1992

4. Thermodynamic modelling and experimental investigation of brazed joint used in aerospace industry;Arafin,2006

5. A diffusional model for transient liquid phase bonding;Cain;Acta Mater.,1997

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