Creep properties of Ag–2wt% Cu alloy in the solid solution region
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference27 articles.
1. Grain structure evolution in a 6061 aluminum alloy during hot torsion
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4. Characterization of Micro-Indentation Creep in β-Sn Single Crystals at Elevated Temperatures
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2. Effect of adding nanometric ZnO particles on thermal, microstructure and tensile creep properties of Sn–6.5 wt%Zn–3 wt%In solder alloy;Journal of Materials Science: Materials in Electronics;2017-05-29
3. Tensile creep characteristics of Sn–3.5Ag–0.5Cu (SAC355) solder reinforced with nano-metric ZnO particles;Materials Science and Engineering: A;2014-05
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