Liquid-state and solid-state interfacial reactions of fluxless-bonded Au–20Sn/ENIG solder joint
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference36 articles.
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1. Microstructure and shear strength of Au-20wt%Sn solder joints fabricated by thermo-compression bonding for LED packages;Journal of Materials Science: Materials in Electronics;2022-03-27
2. Interfacial reactions and mechanical properties of transient liquid-phase bonding joints in Cu/Sn/Ni(P) and Ni/Sn/(OSP)Cu structures for power modules;Journal of Materials Science: Materials in Electronics;2021-01-04
3. Growth of intermetallic compounds and brittle fracture behavior of Sn-Ag-Cu/ENIG joint with columnar Ni-P layer;Journal of Materials Science: Materials in Electronics;2020-11-20
4. Investigations of high-temperature tensile properties of Zn–25Sn–x(0.1–0.2)Cu–y(0.01–0.02)Ti high-temperature Pb-free solders;Journal of Materials Science: Materials in Electronics;2020-09-19
5. Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module;Journal of Welding and Joining;2020-08-30
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