Magnetic properties of CoWP film by electroless deposition
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference12 articles.
1. Electroless Plating: Fundamentals and Applications,1997
2. Improved diffusion barriers for copper metallization obtained by passivation of grain boundaries in electroless deposited cobalt-based films
3. Electrodeposition of Alloys: Principles and Practices;Brenner,1963
4. The interface between metallic substrates and layers of electrodeposited Co–W amorphous alloys
5. Electrodeposition of CoWP film
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