Author:
Ezawa Hirokazu,Miyata Masahiro,Tatsumi Kohei
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference42 articles.
1. Chao-An Jong, Po-Jung Sung, Mei-Yi Lee, Fu-Ju Hou, Kehuey Wu, Ying-Hao Su, Bing-Mau Chen, Chia-Wei Ho, Ren-Jei Chung, Yao-Jen Lee, Wen-Fa Wu, Chenming Hu, Fu-Liang Yang, Electron Devices Meeting (IEDM), IEEE International, 2011, p.7.6.1.
2. Scaling properties and electromigration resistance of sputtered Ag metallization lines
3. Electromigration resistance of sputtered silver lines using different patterning techniques
4. Evaluation of diffusion barrier and electrical properties of tantalum oxynitride thin films for silver metallization
5. Stability of silver thin films on various underlying layers at elevated temperatures
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