Effect of coating current density on the wettability of electrodeposited copper thin film on aluminum substrate
Author:
Funder
National Institute of Technology Karnataka (NITK), India
Publisher
Elsevier BV
Subject
General Engineering
Reference5 articles.
1. Electron microscopic study of nodules formed during electrodeposition of copper on aluminium;Augustin,2015
2. Estimation of lattice strain in nanocrystalline silver from X-ray diffraction line broadening;Biju;J. Mater. Sci.,2008
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4. Revealing the maximum strength in nanotwinned copper;Lu;Science,2009
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