Material removal mechanism of laser-assisted grinding of RB-SiC ceramics and process optimization-Reference-Cited by-同舟云学术

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Material removal mechanism of laser-assisted grinding of RB-SiC ceramics and process optimization

Published:2019-04 Issue:4 Volume:39 Page:705-717
ISSN:0955-2219
Container-title:Journal of the European Ceramic Society
language:en
Short-container-title:Journal of the European Ceramic Society

Author:

Li Zhipeng^ORCID,Zhang Feihu,Luo Xichun^ORCID,Chang Wenlong,Cai Yukui,Zhong Wenbin,Ding Fei

Funder

Self-Planned Task

State Key Laboratory of Robotics and System

National Key Research and Development Program of China

EPSRC project

Publisher

Elsevier BV

Subject

Materials Chemistry,Ceramics and Composites

Reference26 articles.

1. Contact damage of silicon carbide ceramics with different grain structures measured by Hertzian and Vickers indentation;Wade;J. Eur. Ceram. Soc.,2015

2. Grinding induced damage in ceramics;Zhang;J. Mater. Process. Technol.,2003

3. Laser machining of structural ceramics—a review;Samant;J. Eur. Ceram. Soc.,2009

4. Comparison of residual strength behavior after indentation, scratching and grinding of zirconia-based ceramics for medical-technical applications;Denkena;J. Eur. Ceram. Soc.,2018

5. Energy aspects and workpiece surface characteristics in ultrasonic- assisted cylindrical grinding of alumina – zirconia ceramics;Zahedi;Int. J. Mach. Tools Manuf.,2015

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