Graphene nanoplatelets reinforced AgCuTi composite filler for brazing SiC ceramic
Author:
Funder
National Natural Science Foundation of China
Key Research & Development program of Shandong Province
Publisher
Elsevier BV
Subject
Materials Chemistry,Ceramics and Composites
Reference43 articles.
1. Brazing of SiC to a wrought nickel-based superalloy using CoFeNi(Si, B)CrTi filler metal;Xiong;Mater. Lett.,2007
2. Wetting behavior of Co based active brazing alloys on SiC and the interfacial reactions;Xiong;Mater. Lett.,2003
3. Reaction joining of SiC ceramics using TiB-based composites;Tian;J. Eur. Ceram. Soc.,2010
4. The effect of in situ synthesized AlN on densification of SiC ceramics by pressureless sintering;Su;Ceram. Int.,2015
5. Microstructure of high temperature Ti-based brazing alloys and wettability on SiC ceramic;Li;Mater. Design,2009
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