Printing parameters and ink components affecting ultra-fine-line gravure-offset printing for electronics applications

Author:

Pudas Marko,Hagberg Juha,Leppävuori Seppo

Publisher

Elsevier BV

Subject

Materials Chemistry,Ceramics and Composites

Reference23 articles.

1. Low cost high performance structures fabricated by advanced film techniques;Dziurdzia;Microelectronics International,1999

2. Fine-line conductor manufacturing using drop-on demand PZT printing technology;Szczech;Electronics Packaging Manufacturing, IEEE Transactions on,2002

3. Soft lithography;Younan;Annu. Rev. Mater. Res.,1998

4. The absorption ink transfer mechanism of gravure offset printing for electronic circuitry;Pudas;IEEE Transactions on Electronics Packaging Manufacturing,2002

5. Methods for evaluation of fine-line circuitry printing inks;Pudas;European Microelectonics Packaging & Interconnection Symposium, IMAPS Cracow,2002

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