Effect of temperature on the pre-creep mechanical properties of silicon nitride

Author:

Sánchez-González Estíbaliz,Miranda Pedro,Guiberteau Fernando,Pajares Antonia

Publisher

Elsevier BV

Subject

Materials Chemistry,Ceramics and Composites

Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Microstructural and Mechanical Properties of Cubic Silicon Nitride: Insights from Molecular Dynamics Simulation;Journal of Materials Engineering and Performance;2023-01-23

2. Simulations and Experiments to Analyze Stress Phenomena in Soldered and Sintered Interconnections between Silicon Nitride chips and Copper Substrates;2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2021-04-19

3. Molecular dynamics simulation of vacancy cluster formation in β- and α-Si3N4;Computational Materials Science;2020-06

4. Electro-Thermal-Mechanical Modeling of Gas Sensor Hotplates;Sensor Systems Simulations;2019-06-19

5. Influence of some Test Parameters on Automated Ball Indentation Test Results;Experimental Techniques;2017-11-07

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