Simulation of thermal shock cracking in ceramics using bond-based peridynamics and FEM-Reference-Cited by-同舟云学术

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Simulation of thermal shock cracking in ceramics using bond-based peridynamics and FEM

Published:2018-07 Issue:8 Volume:38 Page:3037-3048
ISSN:0955-2219
Container-title:Journal of the European Ceramic Society
language:en
Short-container-title:Journal of the European Ceramic Society

Author:

Giannakeas Ilias N.,Papathanasiou Theodosios K.,Bahai Hamid

Funder

Mechanics of refractory materials at high-temperature for advanced industrial technologies

Publisher

Elsevier BV

Subject

Materials Chemistry,Ceramics and Composites

Reference54 articles.

1. A study of the mechanism of formation and numerical simulations of crack patterns in ceramics subjected to thermal shock;Jiang;Acta Mater.,2012

2. Thermal shock and thermal fatigue study of ceramic materials on a newly developed ascending thermal shock test equipment;Panda;Sci. Technol. Adv. Mater.,2002

3. Ceramic Materials: Science and Engineering;Carter,2007

4. Size effect of thermal shock crack patterns in ceramics and numerical predictions;Wu;J. Eur. Ceram. Soc.,2015

5. Initiation of a periodic array of cracks in the thermal shock problem: a gradient damage modeling;Sicsic;J. Mech. Phys. Solids,2014

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